Vertiv CoolChip CDU 2300 and Vertiv CoolChip Fluid Network Row Manifolds to be showcased at Datacloud Global Congress.
Dubai, UAE [June 2, 2026] – Vertiv, a global leader in critical digital infrastructure, today announced the expansion of its end-to-end thermal chain with the availability of the Vertiv CoolChip CDU 2300 and Vertiv CoolChip Fluid Network Row Manifolds in Europe, Middle East and Africa (EMEA). These liquid cooling technologies support the growing demands of AI and high-density, next-generation compute to help customers deploy high-density infrastructure faster and operate more efficiently.
The Vertiv CoolChip family is a core building block of the Vertiv thermal chain, an end-to-end portfolio including direct-to-chip cooling, immersion cooling, rear-door heat exchangers, coolant distribution, heat rejection, intelligent controls, and lifecycle services into a single, cohesive thermal management system.
The newly announced solutions will be on display at Datacloud Global Congress in Cannes (June 1–4), where Vertiv will participate as a Patron Sponsor and showcase its latest technologies at booth n. 123.
“The rapid growth of AI workloads is driving a fundamental shift in how data centers are designed, cooled, powered and operated,” said Paul Ryan, president forEMEA at Vertiv. “At Datacloud Global Congress, we’re showing how Vertiv is expanding its end‑to‑end portfolio, combining high-density power solutions, liquid cooling, heat rejection, intelligent controls, and lifecycle services, to help customers deploy AI-ready infrastructure faster and operate more efficiently over time.”
